SanDisk (SNDK) announce that they have signed a non-binding memorandum of understanding to form a new production joint venture and construct a new 300 millimeter wafer fab in Japan.

Toshiba Corporation and SanDisk (SNDK) announce that they have signed a non-binding memorandum of understanding to form a new production joint venture and construct a new 300 millimeter wafer fab in Japan.

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